Babkin O.V., Varlamov A.А., Gorshunov R.А., Dos E.V., Kropachev A.V., Zuev D.О.
Babkin Oleg Vyacheslavovich - Strategy Consultant,
IBM;
Varlamov Aleksandr Aleksandrovich - CTO,
SHARXDC LLC,
MOSCOW;
Gorshunov Roman Aleksandrovich - Solution Architect,
AT&T, BRATISLAVA, SLOVAKIA;
Dos Evgenii Vladimirovich - Lead DevOps Architect,
EPAM, MINSK, REPUBLIC OF BELARUS;
Kropachev Artemii Vasilyevich - Principal Architect,
LI9 TECHNOLOGY SOLUTIONS, NORTH CAROLINA;
Zuev Denis Olegovich - Independent Consultant,
NEW JERSEY,
USA
Abstract: methods of data center performance estimation based on mathematical simulation of consumption system were analyzed. Multi-processor system on chip performance enhancement was proved to be optimal instrument of modeling could be. In order to optimize the model centralized control concept, inter-tier liquid cooling and proactive management scheme that rely on model predictive controller were discussed. It was demonstrated that modern thermal management techniques have to be studied. To develop the methodology operating power supply of the platform to near-threshold values, multiple supply voltages utilization optimization method for the voltage islands distribution and microarchitectural techniques to control the thermal hotspots were analyzed. Multi-processor system on chip performance enhancement was demonstrated as application for minimization of the global thermal impact, specifically temperature-aware floorplanning and simulated annealing utilization. While power consumption is generated by two sources it was decided that cost function was defined as a sum of the power input vector and required workload. Developed control system is based on interval steps, which starts at current time. The result of the optimization is proved to be an optimal sequence of control actions. To evaluate developed model were compared application of thermal management load balancing, look up table, fuzzy logic and proactive liquid cooling techniques. Unified thermal modeling methodology based on the finite difference method helps to make a proper analysis of the problem and to build proper applications up to the particular properties. The methodology uses paradigm of search optimal control criteria to find the optimal microchannel width. The main problem of optimization is to minimize the peak temperature and thermal gradients of the model, which allows to reduce the cooling system consumption.
Keywords: data center, power consumption, liquid cooling technique, load balancing, look up table, fuzzy logic, thermal modeling.
References
- Zhang T., Cevrero A., Beanato G., Athanasopoulos P., Coskun, A.K. & Leblebici Y., 3D-MMC: A Modular 3D Multi-Core Architecture with Efficient Resource Pooling. Design. Automation & Test in Europe Conference & Exhibition (DATE), 2013.
- Emi Т. et al. Tape: Thermal-aware agent-based power economy for multi/many-core architectures. InICCAD. Рages 302 –309, 2009.
- Qian Н. et al. Cyber-physical thermal management of 3D multi-core cache-processor system with microfluidic cooling.ASP Journal of Low Power Electronics. 7(1):1–12, 2011.
- Zanini F., Sabry М.М., Atienza D. and De Micheli G. Hierarchical thermal management policy for high-performance 3d systems with liquid cooling.IEEE JETCAS, 1(2):88–101, 2011.
- Aitken R., Flautner K. & Goodacre J., 2010. High-Performance Multiprocessor System on Chip: Trends in Chip Architecture for the Mass Market. Multiprocessor System-on-Chip. 223-239.
- Sabry М.М. et al. Energy-Efficient Multi-Objective Thermal Control for Liquid-Cooled 3D Stacked Architectures.IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 30 (12):1883–1896, 2011.
- ARM®CORTEX®-M4 Development Systems., 2015. Digital Signal Processing Using the ARM® CORTEX®-M4, 1-8.
- Dreslinski R.G. et al. Near-Threshold Computing: Reclaiming Moore’s Law Through Energy Efficient Integrated Circuits. InProc. of the IEEE. 98(2), 2010.
- Xu N. et al. Thermal-Aware Post Layout Voltage-Island Generation for 3D ICs. InJournal of Computer Science and Technology. 28(4):671–681, 2013.
- Puttaswamy К. and Loh G.H. Thermal Herding: Microarchitecture Techniques for Controlling Hotspots in High-Performance 3D-Integrated Processors. InHPCA. Рages 193–204, 2007.
- Han Y., Chakraborty K., Roy S. & Kuntamukkala V., 2011. A GPU Algorithm for IC Floorplanning: Specification, Analysis and Optimization. 2011 24th Internatioal Conference on VLSI Design.
- Sankaranarayanan К., Velusamy S., Stan М. and Skadron К. A Case for Thermal-Aware Floorplanning at the Microarchitectural Level. InJournal of Instruction-Level Parallelism, 8:1–16, 2005.
- Hung W-L. et al. Thermal-Aware Floorplanning Using Genetic Algorithms. InISQED, 2005.
- Liu W. & Nannarelli A., Net Balanced Floorplanning Based on Elastic Energy Model, 2008 Norchip.
- -L. Hung et al. Interconnect and Thermal-Aware Floorplanning for 3D Microprocessors. InISQED, pages 98–104, 2006.
- Healy М. et al. Multiobjective Microarchitectural Floorplanning for 2-D and 3-D ICs. InIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 26 (1), 2007.
- Thermal-Aware Testing of Digital VLSI Circuits and Systems, 2018. doi:10.1201/9781351227780.
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Полная ссылка для цитирования. Babkin O.V., Varlamov A.А., Gorshunov R.А., Dos E.V., Kropachev A.V., Zuev D.О DEVELOPMENT OF HIERARCHICAL MANAGEMENT OF DATA CENTER SERVERS’ HARDWARE
// Научные исследования №5(24). 2018 / XXIX Международная научно-практическая конференция «Научные исследования: ключевые проблемы III тысячелетия» (Россия. Москва. 04 октября 2018). С. {см. журнал}.
Краткая ссылка. Babkin O.V., Varlamov A.А., Gorshunov R.А., Dos E.V., Kropachev A.V., Zuev D.О. DEVELOPMENT OF HIERARCHICAL MANAGEMENT OF DATA CENTER SERVERS’ HARDWARE// Научные исследования №5(24). 2018. С. {см. журнал}.
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